Page 246 - handbook 20162017

Faculty of Science Handbook, Session 2016/2017

References:
1. Donald J. Leo, Engineering analysis of smart material systems SMEB4303 COMPUTATION AND SIMULATION
(Wiley 2007) This course explores the basic concepts of computer modelling and
2. H. R. Chen, Shape Memory Alloys: Manufacture, Properties and simulation in science and engineering. We'll use techniques and
Applications (Nova Science Pub Inc, 2010) software for simulation, data analysis and visualization. Continuum,
3. Andreas Lendlein, Shape-Memory Polymers (Springer 2010) mesoscale, atomistic and quantum methods are used to study
fundamental and applied problem in materials science. Examples
SMEB4301 ELECTROCHEMISTRY drawn from the multi-disciplines are used to understand or characterize
Electrolytes-Liquid Electrolyte Solutions, Ionic Melts, Ionic complex structures of materials and complement experimental
Conductance in Polymers, Ionic Conductance in Solids observations.
Electrode Potentials-Pure Metals, Alloys, Intermetallic Phases and
Compounds Assessment Method:
Ad-Atoms and Underpotential Deposition-The Thermodynamic Final Examination: 50%
Description of the Interphase, The Thermodynamic Description of the Continuous Assessment: 50%
Interphase, Ad-Atoms, Underpotential Deposition
Mass Transport.: Stationary Diffusion, Diffusion in Solid Phases, Medium of Instruction:
Methods to Control Diffusion Overpotential English
Charge Transfer-Electron Transfer, Electrochemical Reaction Orders,
Ion Transfer, Charge Transfer and Mass Transport Soft-skills:
Deposition of Alloys-Alloy Nucleation and Growth: The Partial Current CS3, CT3, LL2
Concept,
Oxide Particles, Corrosion and Corrosion Protection References:
Electrolyte devices 1. Alan Hinchliffe, Molecular modelling for beginners (Wiley 2003)
2. Mauro Ferrario, Giovanni Ciccotti, Kurt Binder, Ettore Majorana
Assessment Method: Foundation and Center for Scientific Culture, Computer
Final Examination: 50% simulations in condensed matter systems: from materials to
Continuous Assessment: 50% chemical biology, Volume 1 (Springer 2006)
3. Tamar Schlick, Molecular Modeling and Simulation: An
Medium of Instruction: Interdisciplinary Guide (Springer 2010)
English
Soft-skills:
CS3, CT3, LL2
References:
1. Allen J. Bard and Larry R. Faulkner , Electrochemical Methods:
Fundamentals and Applications , 2 Edition (Wiley, 2001)
nd
2. John O'M. Bockris, Amulya K.N. Reddy and Maria E. Gamboa-
Aldeco, Modern Electrochemistry 2A: Fundamentals of
Electrodics, Volume 2 (Springer, 2001)
3. John Newman and Karen E. Thomas-Alyea, Electrochemical
Systems, 3rd Edition (Wiley, 2004)
SMEB4302 ADVANCED MATERIALS PROCESSING
TECHNOLOGY
Physical process: Thermal vacuum deposition, e-beam sputtering,
plasma etching, plasma cleaning and conditioning , chemical vapour
deposition, Metal –organic vapour phase epitaxy, molecular-beam
epitaxy, vacuum pressure impregnation, micro-nano-laser fabrication
and processing,
Chemical process: sol-gel processing, hydrothermal, solvothermal,
ionothermal, self-assembly assisted method, pyrolysis, radiation
assisted method
Basic processing of bulk ceramic: Preparation of polymers and glass
Fabrication methods, diffusion, ion implantation, lithography,
metallization.
Invitation from industry to give a presentation on Advanced Materials
Processing Technology in his/her company.

Assessment Method:
Final Examination: 50%
Continuous Assessment: 50%
Medium of Instruction:
English

Soft-skills:
CS2, CT3, LL2
References:
1. Thin-Film Deposition: Principles and Practice by Donald Smith
2. Handbook of Physical Vapor Deposition (PVD) Processing
(Materials Science and Process Technology) by Donald M. Mattox
3. Advanced Ceramic Processing & Technology (Materials Science
and Process Technology)

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