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COURSE PRO FORMA


            IMPORTANT:

            Contents of this Pro Forma shall not be changed without the Senate’s approval for items indicated with *. Changes
            to the other items can be approved at the Academy/Faculty/Institution/Centre level.
           Academy/Faculty/Centre                Engineering

           Department                            Mechanical Engineering
           Programme                             Materials Engineering
           Course Code*                          KMEB 4352

           Course Title*                         Materials and Processes in Semiconductor Manufacturing

           Course Pre-requisite(s)/ Minimum Require-  None
           ment(s)

           Student Learning Time (SLT)*          120 h

           Credit*                               3
           Course Learning Outcomes*             At the end of the course, students are able to:
                                                 1.   Explain the process sequence in semiconductor manufacturing and the
                                                    importance of semiconductor industry in global and Malaysian economy
                                                 2.   Analyze the fundamental principles underlying different semiconductor
                                                    manufacturing processes
                                                 3.   Assess the suitability of different materials and processes for various
                                                    steps in integrated circuit (IC) fabrication and packaging


           Transferable Skills                   None
           Synopsis of Course Contents           Introduction to semiconductor industry and its importance in global and Ma-
                                                 laysian economy.  Overview of semiconductor devices and overall semicon-
                                                 ductor manufacturing processes.  Crystal growth processes and wafer prep-
                                                 aration, lithographic techniques and materials, oxidation and thermal pro-
                                                 cesses, ion implantation, wet and plasma etching, thin film deposition and
                                                 metallization, chemical mechanical polishing. Testing and packaging. Clean
                                                 room basics and protocol.


           Learning Strategies (lecture, tutorial, work-  Lecture, tutorial, active learning, cooperative learning
           shop, discussion, etc)

           Assessment Weightage*                 Continuous assessment  : 40%
                                                 Final examination: 60%

           Methodologies for Feedback on Perfor-  1.   Announcement of marks for assignments and continuous assessment
           mance                                    before the final examination.
                                                 2.   Grades for final exam will be given.

            Criteria in Summative Assessment
                                                 Refer to the University of Malaya (First Degree) Rules 2013 and the   Uni-
                                                 versity of Malaya (First Degree) Regulations 2013.
            UM-PT01-PK03-BR003(BI)-S04
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