Page 47 - handbook 20152016

Faculty of Science Handbook, Session 2015/2016

Medium of Instruction: Soft-skills:
English CS2, CT3, LL2

Soft-skills: References:
CS3, CT3, LL2 1. Thin-Film Deposition: Principles and Practice by Donald Smith
2. Handbook of Physical Vapor Deposition (PVD) Processing
References: (Materials Science and Process Technology) by Donald M. Mattox
1. Donald J. Leo, Engineering analysis of smart material systems 3. Advanced Ceramic Processing & Technology (Materials Science
(Wiley 2007) and Process Technology)
2. H. R. Chen, Shape Memory Alloys: Manufacture, Properties and
Applications (Nova Science Pub Inc, 2010) SMEB4303 COMPUTATION AND SIMULATION
3. Andreas Lendlein, Shape-Memory Polymers (Springer 2010)
This course explores the basic concepts of computer modelling and
SMEB4301 ELECTROCHEMISTRY simulation in science and engineering. We'll use techniques and
software for simulation, data analysis and visualization. Continuum,
Electrolytes-Liquid Electrolyte Solutions, Ionic Melts, Ionic mesoscale, atomistic and quantum methods are used to study
Conductance in Polymers, Ionic Conductance in Solids fundamental and applied problem in materials science. Examples
Electrode Potentials-Pure Metals, Alloys, Intermetallic Phases and drawn from the multi-disciplines are used to understand or characterize
Compounds complex structures of materials and complement experimental
Ad-Atoms and Underpotential Deposition-The Thermodynamic observations.
Description of the Interphase, The Thermodynamic Description of the
Interphase, Ad-Atoms, Underpotential Deposition Assessment Method:
Mass Transport.: Stationary Diffusion, Diffusion in Solid Phases, Final Examination: 50%
Methods to Control Diffusion Overpotential Continuous Assessment: 50%
Charge Transfer-Electron Transfer, Electrochemical Reaction Orders,
Ion Transfer, Charge Transfer and Mass Transport Medium of Instruction:
Deposition of Alloys-Alloy Nucleation and Growth: The Partial Current English
Concept,
Oxide Particles, Corrosion and Corrosion Protection Soft-skills:
Electrolyte devices CS3, CT3, LL2

Assessment Method: References:
Final Examination: 50% 1. Alan Hinchliffe, Molecular modelling for beginners (Wiley 2003)
Continuous Assessment: 50% 2. Mauro Ferrario, Giovanni Ciccotti, Kurt Binder, Ettore Majorana
Foundation and Center for Scientific Culture, Computer
Medium of Instruction: simulations in condensed matter systems: from materials to
English chemical biology, Volume 1 (Springer 2006)
3. Tamar Schlick, Molecular Modeling and Simulation: An
Soft-skills: Interdisciplinary Guide (Springer 2010)
CS3, CT3, LL2

References:

1. Allen J. Bard and Larry R. Faulkner , Electrochemical Methods:
Fundamentals and Applications , 2 Edition (Wiley, 2001)
nd
2. John O'M. Bockris, Amulya K.N. Reddy and Maria E. Gamboa-
Aldeco, Modern Electrochemistry 2A: Fundamentals of
Electrodics, Volume 2 (Springer, 2001)
3. John Newman and Karen E. Thomas-Alyea, Electrochemical
Systems, 3rd Edition (Wiley, 2004)

SMEB4302 ADVANCED MATERIALS PROCESSING
TECHNOLOGY

Physical process: Thermal vacuum deposition, e-beam sputtering,
plasma etching, plasma cleaning and conditioning , chemical vapour
deposition, Metal –organic vapour phase epitaxy, molecular-beam
epitaxy, vacuum pressure impregnation, micro-nano-laser fabrication
and processing,
Chemical process: sol-gel processing, hydrothermal, solvothermal,
ionothermal, self-assembly assisted method, pyrolysis, radiation
assisted method
Basic processing of bulk ceramic: Preparation of polymers and glass
Fabrication methods, diffusion, ion implantation, lithography,
metallization.
Invitation from industry to give a presentation on Advanced Materials
Processing Technology in his/her company.

Assessment Method:
Final Examination: 50%
Continuous Assessment: 50%

Medium of Instruction:
English

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