Page 224 - Handbook Bachelor Degree of Science Academic Session 20202021

Faculty of Science Handbook, Academic Session 2020/2021

References:
Soft-skills: 1. Thermal Conductivity: Theory, Properties, and Applications
CS2, CT3, LL2 (Physics of Solids and Liquids) by Terry M. Tritt (Nov 29, 2010)
2. Introduction to the Thermodynamics of Materials, Fifth Edition by
References: David R. Gaskell (Mar 13, 2008)
1. M. Fox, Optical Properties of Solids (Oxford Series in Condensed 3. Thermodynamics in Materials Science, Second Edition by Robert
Matter Physics (Oxford University Press, 2002) T. DeHoff (Mar 13, 2006)
2. B.E.A Saleh, M.C Teich, Fundamentals of Photonics (Wiley Series
in Pure and Applied Optics, (Wiley-Blackwell,2007) SMEB2206 POLYMER PHYSICS
3. R.J.D Tilley, Colour and The Optical Properties of Materials: An
Exploration of the Relationship Between Light, the Optical Introduction to polymer. Morphology, structure and physical properties
Properties of Materials and Colour (Wiley, 2011) of polymer. Viscosity, rubber elasticity, transition and relaxation.
Superposition of time-temperature, WLF equation. Special applied
polymer, conducting polymer. Technological importance polymers.
SMEB2204 MATERIALS CHARACTERISATION
Assessment Method:
Structural, morphological, thermal, electrical, magnetic and mechanical, Final Examination: 60%
chemical characterisation of material: Continuous Assessment: 40%
Light microscopy, x-ray diffraction, scanning probe microscopy ,
scanning electron microscopy, transmission electron microscopy, UV- Medium of Instruction:
VIS-NIR, auger electron spectroscopy, fast fourier transform infrared English
spectroscopy, secondary ion mass spectroscopy, four-point probe,
thermogavimetry, differential scanning calorimetry , thermogravimetry, Soft-skills:
electrical impedance spectroscopy, vibrating sample magnetometer. CS2, CT3, LL2, EM1
Basic operation, sample preparation and interpretation of data. Basic
failure analysis of materials using different characterization equipment. References:
1. J.L. Fried, Polymer Science and Technology, Prentice Hall, 1995.
Assessment Method: 2. N.G. McCrum, C.P. Buckley and C.B. Bucknall, Principles of
Final Examination: 60% Polymer Engineering, Oxford University Press, 1988.
Continuous Assessment: 40% 3. P.Painter and M.M Coleman, Fundamentals of Polymer Science
(AN Introductory Text), Technomic
Medium of Instruction: 4. D.J. Bower, An Introduction to Polymer Physics, Cambridge Univ.
English Press 2002.

Soft-skills: SMEB2207 COMPUTER PROGRAMMING
CS3, CT3, LL2
Students are equipped with the fundamentals of how the computer
References: works. The important components in a computer will be explained in
1. Materials Characterization: Introduction to Microscopic and detail. Students are taught to perform computer programming using C
Spectroscopic Methods by Y. Leng (Jun 2, 2008) language. The basic statements are discussed and the methodology is
2. Materials Characterization Techniques [Hardcover] Sam Zhang shown. C++ will also be briefly introduced.
(Author), Lin Li (Author), Ashok Kumar (Author)
3. Surface Analysis: The Principal Techniques [Paperback] John C. Assessment Method:
Vickerman (Editor), Ian Gilmore (Editor) Final Examination: 60%
Continuous Assessment: 40%

SMEB2205 THERMAL PROPERTIES OF MATERIALS Medium of Instruction:
English
Basic concept: thermal conductivity. Phonons, molar heat capacity
Heat, Work, and Energy, Heat Capacity, Molar Heat Capacity, Specific Soft-skills:
Heat Capacity CS2, CT3, LL2
Atomistic Theory of Heat Capacity; Einstein Model; Debye Model;
Electronic Contribution to the Heat Capacity; thermal effective mass References:
Classical and quantum approach of thermal conduction, 1. Richard Johnsonbaugh and Martin Kalin, C for Scientists and
Thermal conduction in dielectric materials; thermal expansion, Engineers, 1 edition (Prentice Hall,Oct 12, 1996)
st
thermal stress 2. Robert L. Wood, C Programming for Scientists and Engineers
Conduction heat transfer: Fourier's law of conduction, Newton's law (Manufacturing Engineering Series) (Butterworth-Heinemann, Jun
of cooling; Nusselt Number; Stefan-Boltzmann's Law of Radiation; 20, 2002)
radiative heat transfer coefficient; 3. David R. Brooks, C Programming: The Essentials for Engineers
Thermal Resistance concept: Conduction, Convection Contact and Scientists (Undergraduate Texts in Computer Science), 1
st
,Resistance Radiation Resistance edition (Springer,Jun 4, 1999)
Heat dissipation technology: Heat-sink ,fin, heat spreader, heat pipe,
heat pump, Peltier cooling plates SMEB2271 MATERIAL SCIENCE LABORATORY I

Assessment Method: Students are attached to research labs carrying out mini-projects on
Final Examination: 60% experiments in material science in characterizing electrical, optical,
Continuous Assessment: 40% magnetic, mechanical, thermal properties of photonic materials, smart
materials electrochemistry, polymer composite, semiconductor
Medium of Instruction:
English materials organic electronics , devices and advanced material
processing while learning to use various characterizing equipment such
Soft-skills: as scanning electron microscopy, micro-Raman spectroscopy, UV-VIS-
CS3, CT3, LL2 NIR spectroscopy, Light microscopy, x-ray diffraction, scanning probe
microscopy , scanning electron microscopy, transmission electron
microscopy, auger electron spectroscopy, fast Fourier transform

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