Page 243 - buku panduan 20192020

Faculty of Science Handbook, Session 2019/2020

Soft-skills: SMEB2207 COMPUTER PROGRAMMING
CS3, CT3, LL2
Students are equipped with the fundamentals of how the computer
References: works. The important components in a computer will be explained in
1. Materials Characterization: Introduction to Microscopic and detail. Students are taught to perform computer programming using C
Spectroscopic Methods by Y. Leng (Jun 2, 2008) language. The basic statements are discussed and the methodology is
2. Materials Characterization Techniques [Hardcover] Sam Zhang shown. C++ will also be briefly introduced.
(Author), Lin Li (Author), Ashok Kumar (Author)
3. Surface Analysis: The Principal Techniques [Paperback] John C. Assessment Method:
Vickerman (Editor), Ian Gilmore (Editor) Final Examination: 60%
Continuous Assessment: 40%

SMEB2205 THERMAL PROPERTIES OF MATERIALS Medium of Instruction:
English
Basic concept: thermal conductivity. Phonons, molar heat capacity
Heat, Work, and Energy, Heat Capacity, Molar Heat Capacity, Specific Soft-skills:
Heat Capacity CS2, CT3, LL2
Atomistic Theory of Heat Capacity; Einstein Model; Debye Model;
Electronic Contribution to the Heat Capacity; thermal effective mass References:
Classical and quantum approach of thermal conduction, 1. Richard Johnsonbaugh and Martin Kalin, C for Scientists and
st
Thermal conduction in dielectric materials; thermal expansion, thermal Engineers, 1 edition (Prentice Hall,Oct 12, 1996)
stress 2. Robert L. Wood, C Programming for Scientists and Engineers
Conduction heat transfer: Fourier's law of conduction, Newton's law of (Manufacturing Engineering Series) (Butterworth-Heinemann, Jun
cooling; Nusselt Number; Stefan-Boltzmann's Law of Radiation; 20, 2002)
radiative heat transfer coefficient; 3. David R. Brooks, C Programming: The Essentials for Engineers
st
Thermal Resistance concept: Conduction, Convection Contact and Scientists (Undergraduate Texts in Computer Science), 1
,Resistance Radiation Resistance edition (Springer,Jun 4, 1999)
Heat dissipation technology: Heat-sink ,fin, heat spreader, heat pipe,
heat pump, Peltier cooling plates SMEB2271 MATERIAL SCIENCE LABORATORY I

Assessment Method: Students are attached to research labs carrying out mini-projects on
Final Examination: 60% experiments in material science in characterizing electrical, optical,
Continuous Assessment: 40% magnetic, mechanical, thermal properties of photonic materials, smart
materials electrochemistry, polymer composite, semiconductor materials
Medium of Instruction:
English organic electronics , devices and advanced material processing while
learning to use various characterizing equipment such as scanning
Soft-skills: electron microscopy, micro-Raman spectroscopy, UV-VIS-NIR
CS3, CT3, LL2 spectroscopy, Light microscopy, x-ray diffraction, scanning probe
microscopy , scanning electron microscopy, transmission electron
References: microscopy, auger electron spectroscopy, fast Fourier transform infrared
1. Thermal Conductivity: Theory, Properties, and Applications spectroscopy, four-point probe, thermogravimetry, differential scanning
(Physics of Solids and Liquids) by Terry M. Tritt (Nov 29, 2010)
2. Introduction to the Thermodynamics of Materials, Fifth Edition by calorimetry, electrical impedance spectroscopy and simple material
David R. Gaskell (Mar 13, 2008) process technology. Students will be exposed with Labview
3. Thermodynamics in Materials Science, Second Edition by Robert programming.
T. DeHoff (Mar 13, 2006)
Assessment Method:
Continuous Assessment: 100%
SMEB2206 POLYMER PHYSICS
Medium of Instruction:
Introduction to polymer. Morphology, structure and physical properties English
of polymer. Viscosity, rubber elasticity, transition and relaxation.
Superposition of time-temperature, WLF equation. Special applied Soft-skills:
polymer, conducting polymer. Technological importance polymers. CS2, CT3, LL2

Assessment Method: References:
Final Examination: 60% 1. Y. Leng, Materials Characterization: Introduction to Microscopic
Continuous Assessment: 40% and Spectroscopic Methods, 1 edition (Wiley, Jun 2, 2008)
st
2. Sam Zhang, Lin Li, Ashok Kumar Materials Characterization
Medium of Instruction: Techniques, 1 edition (CRC Press, Disember 22, 2008)
st
English 3. Angelika H. Hofmann, Scientific Writing and Communication:
Papers, Proposals, and Presentations, 1 edition (Oxford University
Soft-skills: Press, Disember 16, 2009)
CS2, CT3, LL2, EM1
LEVEL 3
References:
1. J.L. Fried, Polymer Science and Technology, Prentice Hall, 1995.
2. N.G. McCrum, C.P. Buckley and C.B. Bucknall, Principles of SMEB3271 MATERIAL SCIENCE LABORATORY II
Polymer Engineering, Oxford University Press, 1988.
3. P.Painter and M.M Coleman, Fundamentals of Polymer Science Students are attached to research labs carrying out mini-projects on
(AN Introductory Text), Technomic experiments in material science in characterizing electrical, optical,
4. D.J. Bower, An Introduction to Polymer Physics, Cambridge Univ. magnetic, mechanical, thermal properties of photonic materials, smart
Press 2002. materials electrochemistry, polymer composites, semiconductor
materials organic electronics, devices and advanced material

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